| Publication CODE |
Title |
| IEC 62899-202-7:2021 (2021-03) |
PRINTED ELECTRONICS - PART 202-7: MATERIALS - PRINTED FILM - MEASUREMENT OF PEEL STRENGTH FOR PRINTED LAYER ON FLEXIBLE SUBSTRATE BY 90° PEEL METHOD |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
12. |
Description
IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 119
PRINTED ELECTRONICS
|
| Responsible |
Monsieur DE LEEUW Thierry, Technical Officer
Diamant Building
Bd Auguste Reyers, 80
1030
BRUXELLES
Phone: +32 2 706 85 72
E-mail: thierry.deleeuw@ceb-bec.be
|
| BEC Approval |
2021-03-03 |
| ICS-Code (International Standards Classification) |
29.035.01
, 31.180
|
| NBN Status |
New |
|
| IEC publication date |
2021-03-03 |
| IEC stability date |
2025-12-31 |
| IEC file modification date |
2021-03-03 |
| IEC last modification date |
2021-03-03 |
|
