| Publication CODE |
Title |
| IEC 62899-202-10:2023 (2023-08) |
PRINTED ELECTRONICS - PART 202-10: MATERIALS - RESISTANCE MEASUREMENT METHOD FOR THERMOFORMABLE CONDUCTING LAYER |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
201.00 €
|
26. |
Description
IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 119
PRINTED ELECTRONICS
|
| Responsible |
Monsieur DE LEEUW Thierry, Technical Officer
Diamant Building
Bd Auguste Reyers, 80
1030
BRUXELLES
Phone: +32 2 706 85 72
E-mail: thierry.deleeuw@ceb-bec.be
|
| BEC Approval |
2023-08-16 |
| ICS-Code (International Standards Classification) |
29.035.01
, 31.180
|
| NBN Status |
New |
|
| IEC publication date |
2023-08-16 |
| IEC stability date |
2028-12-31 |
| IEC file modification date |
2023-08-16 |
| IEC last modification date |
2023-08-16 |
|
