| Publication CODE |
Title |
| IEC 60749-22:2002 (2002-09) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
41. |
Description
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.
The contents of the corrigendum of August 2003 have been included in this copy.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2002-09-12 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
2002-09-12 |
| IEC stability date |
2025-12-31 |
| IEC last modification date |
2018-01-11 |
|
