| Publication CODE |
Title |
| IEC 61189-2-805:2024 (2024-04) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-805: X/Y CTE TEST FOR THIN BASE MATERIALS BY TMA |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
20. |
Description
IEC 61189-2-805:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2024-04-18 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2024-04-18 |
| IEC stability date |
2027-12-31 |
| IEC file modification date |
2024-04-18 |
| IEC last modification date |
2024-04-18 |
|
