Publication CODE |
Title |
IEC 60749-22:2002/COR1:2003 (2003-08) |
CORRIGENDUM 1 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH |
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Price Excl. VAT |
Total number of pages, tables and drawings |
0.00 €
|
0. |
Description
[Text at this stage is not available in English]
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Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
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Available files
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ATTENTION: With some browsers, you may experience problems if you open the downloaded file directly. If you experience this problem, please first save the file locally and then open it |
Status |
IEC PUBLICATION |
Situation |
Currently active
|
|
Committee |
TC 47
SEMICONDUCTOR DEVICES
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Responsible |
Ir DELENS Marc
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BEC Approval |
2003-08-13 |
ICS-Code (International Standards Classification) |
31.080.01
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NBN Status |
New |
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IEC publication date |
2003-08-13 |
IEC stability date |
2025-12-31 |
IEC last modification date |
2018-01-11 |
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