Publication CODE |
Title |
NBN EN 60068-2-20:2009 (2008-09) |
ENVIRONMENTAL TESTING
PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
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Price Excl. VAT |
Total number of pages, tables and drawings |
25.00 €
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3 P. |
Description
Outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. Provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
The procedures in this standard include the solder bath method and soldering iron method.
The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering.
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Class |
C20
(ELECTRICAL MANUFACTURE - ELECTROTECHNICAL MATERIALS GENERAL)
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Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 60068-2-20:2008.
For the series NBN EN 50XXX, the standards are however complete.
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EN version
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DE version
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FR version
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Status |
Registered trilingual Belgian standard EN or FR or DE |
Situation |
Currently active
Replaces
HD 323.2.20 S3:1988
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Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
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Responsible |
De heer VAN HECKE Luk
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BEC Approval |
2008-08-01 |
NBN Approval |
2009-09-04 |
Belgian Official Journal |
2009-11-13 |
Registration |
96244 |
ICS-Code (International Standards Classification) |
19.040
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NBN Status |
New |
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Date of ratification (d.o.r.) |
2008-08-01 |
Date of availability (d.a.v.) |
2008-09-25 |
Date of announcement (d.o.a.) |
2008-11-01 |
Date of publication (d.o.p.) |
2009-05-01 |
Date of withdrawal former edition (d.o.w.) |
2011-08-01 |
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