| Publication CODE |
Title |
| IEC TR 62258-7:2007 (2007-08) |
SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
201.00 €
|
26. |
Description
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
TECHNICAL REPORT |
| Situation |
Currently active
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2007-08-23 |
| ICS-Code (International Standards Classification) |
31.080.99
|
|
| IEC publication date |
2007-08-23 |
| IEC stability date |
2026-12-31 |
| IEC last modification date |
2019-11-20 |
|
