| Publication CODE |
Title |
| NBN EN 62418:2010 (2010-07) |
SEMICONDUCTOR DEVICES - METALLIZATION STRESS VOID TEST |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
25.00 €
|
2 P. |
Description
Describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
This standard is applicable for reliability investigation and qualification of semiconductor process.
|
| Class |
C80
(ELECTRONIC COMPONENTS GENERAL)
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 62418:2010.
For the series NBN EN 50XXX, the standards are however complete.
|
EN version
|
FR version
|
DE version
|
|
| Status |
Registered trilingual Belgian standard EN or FR or DE |
| Situation |
Currently active
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2010-07-01 |
| NBN Approval |
2010-08-27 |
| Belgian Official Journal |
2010-10-18 |
| Registration |
107270 |
| ICS-Code (International Standards Classification) |
31.080
|
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2010-07-01 |
| Date of availability (d.a.v.) |
2010-07-09 |
| Date of announcement (d.o.a.) |
2010-10-01 |
| Date of publication (d.o.p.) |
2011-04-01 |
| Date of withdrawal former edition (d.o.w.) |
2013-07-01 |
|
