Publication CODE |
Title |
IEC 60191-6-13:2016 (2016-09) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA) |
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Price Excl. VAT |
Total number of pages, tables and drawings |
122.00 €
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36 P.. |
Description
IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.
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Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
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Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
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Responsible |
Ir DELENS Marc
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BEC Approval |
2016-09-27 |
ICS-Code (International Standards Classification) |
31.080.01
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NBN Status |
New |
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IEC publication date |
2016-09-27 |
IEC stability date |
2020-12-31 |
IEC file modification date |
2016-09-27 |
IEC last modification date |
2016-09-27 |
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