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Publication details

Publication CODE Title
IEC TR 61191-8:2021 (2021-03) PRINTED BOARD ASSEMBLIES - PART 8: VOIDING in SOLDER JOINTS OF PRINTED BOARD ASSEMBLIES FOR USE in AUTOMOTIVE ELECTRONIC CONTROL UNITS - BEST PRACTICES
 
Price Excl. VAT Total number of pages, tables and drawings
249.00 € 34.
Description
IEC TR 61191-8:2021(E) gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components with printed boards (PBs). Voids in other solder joints (e.g. in a joint between a silicon die and a substrate within an electronic component, solder joints of through-hole components, etc.) are not considered. The technical background for the occurrence of voids in solder joints, the potential impact of voiding on printed board assembly reliability and functionality, the investigation of voiding levels in sample- and series-production by use of X'ray inspection as well as typical voiding levels in different types of solder joints are discussed. Recommendations for the control of voiding in series production are also given. Annex A collects typical voiding levels of components and recommendations for acceptability.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2021-03-19
ICS-Code (International Standards Classification) 31.180 , 31.190
NBN Status New
IEC publication date 2021-03-19
IEC stability date 2026-12-31
IEC file modification date 2021-03-19
IEC last modification date 2021-03-19