| Publication CODE |
Title |
| IEC 61189-2-807:2021 (2021-09) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-807: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - DECOMPOSITION TEMPERATURE (TD) USING TGA |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
17. |
Description
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2021-09-03 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2021-09-03 |
| IEC stability date |
2026-12-31 |
| IEC file modification date |
2021-09-03 |
| IEC last modification date |
2021-09-03 |
|
