| Publication CODE |
Title |
| IEC 61760-3:2010 (2010-03) |
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
45 P. |
Description
IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| Registration |
105720 |
| ICS-Code (International Standards Classification) |
31.190
|
| NBN Status |
New |
|
| IEC publication date |
2010-03-16 |
| IEC stability date |
2021-12-31 |
| IEC last modification date |
2017-11-15 |
|
