| Publication CODE |
Title |
| IEC 60749-40:2011 (2011-07) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
44 P. |
Description
IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2011-07-13 |
| Registration |
116372 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| IEC publication date |
2011-07-13 |
| IEC stability date |
2025-12-31 |
| IEC last modification date |
2018-11-22 |
|
