Publication CODE |
Title |
IEC 62047-43:2024 (2024-03) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 43: TEST METHOD OF ELECTRICAL CHARACTERISTICS AFTER CYCLIC BENDING DEFORMATION FOR FLEXIBLE MICRO-ELECTROMECHANICAL DEVICES |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
122.00 €
|
18. |
Description
IEC 62047-43:2024 specifies the test method of electrical characteristics after cyclic bending deformation for flexible electromechanical devices. These devices include passive micro components and active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 'm to 1 mm, but these are not limiting values. The test method is so designed as to understand and further visualize the entire performance deterioration behaviour after cyclic bending deformation in a concept of 3D (P-S-N: Performance - Severity of bending - Number of cycles) plot over the loading space of severity of bending and number of repeated cycles. This document is essential to estimate safety margin over the operation period under a certain level of cyclic bending deformation and indispensable for reliable design of the product employing these devices.
|
Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Status |
IEC PUBLICATION |
Situation |
Currently active
|
|
Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
Responsible |
Ir DELENS Marc
|
BEC Approval |
2024-03-19 |
ICS-Code (International Standards Classification) |
31.080.99
|
NBN Status |
New |
|
IEC publication date |
2024-03-19 |
IEC stability date |
2028-12-31 |
IEC file modification date |
2024-03-19 |
IEC last modification date |
2024-03-19 |
|