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Publication details

Publication CODE Title
IEC 61191-3:2017 (2017-05) PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
 
Price Excl. VAT Total number of pages, tables and drawings
122.00 € 20.
Description
IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Replaces  IEC 61191-3:1998
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2017-05-30
ICS-Code (International Standards Classification) 31.240
NBN Status New
IEC publication date 2017-05-30
IEC stability date 2024-12-31
IEC file modification date 2017-05-30
IEC last modification date 2019-09-20