| Publication CODE |
Title |
| IEC 63251:2023 (2023-11) |
TEST METHOD FOR MECHANICAL PROPERTIES OF FLEXIBLE OPTO-ELECTRIC CIRCUIT BOARDS UNDER THERMAL STRESS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
42. |
Description
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2023-11-01 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2023-11-01 |
| IEC stability date |
2028-12-31 |
| IEC file modification date |
2023-11-01 |
| IEC last modification date |
2023-11-01 |
|
