| Publication CODE |
Title |
| IEC 62137-1-1:2007 (2007-07) |
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
30. |
Description
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2007-07-01 |
| ICS-Code (International Standards Classification) |
31.190
|
|
| IEC publication date |
2007-07-11 |
| IEC stability date |
2023-12-31 |
| IEC last modification date |
2019-11-20 |
|
