| Publication CODE |
Title |
| NBN EN IEC 61760-3:2021 (2021-03) |
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH-HOLE REFLOW (THR) SOLDERING |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
18.00 €
|
5. |
Description
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended.
Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.
|
| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
|
|
|
| Committee |
CLC/SR 91
Electronics assembly technology
|
| BEC Approval |
2021-03-10 |
| NBN Approval |
2021-03-17 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2021-03-10 |
| Date of announcement (d.o.a.) |
2021-06-10 |
| IEC file modification date |
2021-03-13 |
|
