| Publication CODE |
Title |
| NBN EN IEC 60749-20:2020 (2020-11) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
14.00 €
|
3. |
Description
IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.
|
| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
|
DE version
|
EN version
|
FR version
|
|
| Committee |
CLC/SR 47
Semiconductor devices
|
| BEC Approval |
2020-10-05 |
| NBN Approval |
2020-11-19 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2020-10-05 |
| Date of announcement (d.o.a.) |
2021-01-05 |
| IEC file modification date |
2020-10-10 |
|
