| Publication CODE |
Title |
| NBN EN IEC 60749-5:2024 (2024-01) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
14.00 €
|
3. |
Description
IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition:
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to 'virtual junction' with 'die'.
|
| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
|
|
|
| Committee |
CLC/SR 47
Semiconductor devices
|
| BEC Approval |
2024-01-23 |
| NBN Approval |
2024-01-31 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2024-01-23 |
| Date of announcement (d.o.a.) |
2024-04-23 |
| Date of publication (d.o.p.) |
2024-10-23 |
| Date of withdrawal former edition (d.o.w.) |
2027-01-23 |
| IEC file modification date |
2024-01-27 |
|
