| Publication CODE |
Title |
| IEC 62951-5:2019 (2019-02) |
SEMICONDUCTOR DEVICES - FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES - PART 5: TEST METHOD FOR THERMAL CHARACTERISTICS OF FLEXIBLE MATERIALS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
33. |
Description
IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2019-02-27 |
| ICS-Code (International Standards Classification) |
31.080.99
|
| NBN Status |
New |
|
| IEC publication date |
2019-02-27 |
| IEC stability date |
2023-12-31 |
| IEC file modification date |
2019-02-27 |
| IEC last modification date |
2019-02-27 |
|
