| Publication CODE |
Title |
| IEC 60749-16:2003 (2003-01) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
21.00 €
|
13. |
Description
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2003-01-17 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
2003-01-17 |
| IEC stability date |
2031-12-31 |
| IEC last modification date |
2019-11-20 |
|
