| Publication CODE |
Title |
| IEC PAS 62170:2000 (2000-08) |
BOND WIRE MODELING STANDARD |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
12. |
Description
Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers.
Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond configuration.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Withdrawn
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2000-08-24 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
2000-08-24 |
| IEC last modification date |
2004-05-17 |
|
