| Publication CODE |
Title |
| IEC 60749-19:2003 (2003-02) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
21.00 €
|
11. |
Description
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2003-02-13 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
2003-02-13 |
| IEC stability date |
2025-12-31 |
| IEC last modification date |
2018-11-22 |
|
