| Publication CODE |
Title |
| IEC 62418:2010 (2010-04) |
SEMICONDUCTOR DEVICES - METALLIZATION STRESS VOID TEST |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
16 P. |
Description
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2010-04-22 |
| Registration |
106123 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| IEC publication date |
2010-04-22 |
| IEC stability date |
2025-12-31 |
| IEC last modification date |
2018-11-22 |
|
