Publication CODE |
Title |
IEC 61189-2-808:2024 (2024-04) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-808: THERMAL RESISTANCE OF AN ASSEMBLY BY THERMAL TRANSIENT METHOD |
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Price Excl. VAT |
Total number of pages, tables and drawings |
122.00 €
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40. |
Description
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
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Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
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Status |
IEC PUBLICATION |
Situation |
Currently active
|
|
Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
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Responsible |
De heer VAN HECKE Luk
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BEC Approval |
2024-04-25 |
ICS-Code (International Standards Classification) |
31.180
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NBN Status |
New |
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IEC publication date |
2024-04-25 |
IEC stability date |
2028-12-31 |
IEC file modification date |
2024-04-25 |
IEC last modification date |
2024-04-25 |
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