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Publication details

Publication CODE Title
IEC 60749-19:2003 (2003-02) SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH
 
Price Excl. VAT Total number of pages, tables and drawings
21.00 € 11.
Description
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Partly replaces  IEC 60749:1996
Partly replaces  IEC 60749:1996+AMD1:2000+AMD2:2001 CSV
Partly replaces  IEC 60749:1996/AMD1:2000
Partly replaces  IEC 60749:1996/AMD2:2001
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2003-02-13
ICS-Code (International Standards Classification) 31.080.01
IEC publication date 2003-02-13
IEC stability date 2025-12-31
IEC last modification date 2018-11-22