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Publication details

Publication CODE Title
IEC 62769-6:2023 (2023-04) FIELD DEVICE INTEGRATION (FDI®) - PART 6: FDI TECHNOLOGY MAPPINGS
 
Price Excl. VAT Total number of pages, tables and drawings
21.00 € 14.
Description
IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Replaces  IEC 62769-6:2021
Replaces  IEC 62769-6:2021 RLV
Origin
Committee TC 65/SC 65E
SYSTEM: ENGINEERING AND MANAGEMENT
Responsible Ir DELENS Marc
Approval
BEC Approval 2023-04-06
ICS-Code (International Standards Classification) 25.040.40 , 35.100.05
NBN Status New
IEC publication date 2023-04-06
IEC stability date 2025-12-31
IEC file modification date 2023-04-06
IEC last modification date 2023-04-06