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Publication details

Publication CODE Title
IEC 61189-2:2006 (2006-05) TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES
 
Price Excl. VAT Total number of pages, tables and drawings
366.00 € 122.
Description
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Replaces  IEC 61189-2:1997
Replaces  IEC 61189-2:1997/AMD1:2000
Replaces  IEC 61189-2:1997/COR1:1997
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2006-05-30
ICS-Code (International Standards Classification) 31.180
IEC publication date 2006-05-30
IEC stability date 2023-12-31
IEC last modification date 2019-11-20