| Publication CODE |
Title |
| NBN EN 61191-6:2010 (2010-04) |
PRINTED BOARD ASSEMBLIES
PART 6: EVALUATION CRITERIA FOR VOIDS in SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
25.00 €
|
3 P. |
Description
Specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.
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| Class |
C93
(TELECOMMUNICATIONS - ELECTRONIC PASSIVE ELECTRONIC COMPONENTS AND OPTICAL FIBRES (SEE ALSO C90))
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered electronically on our website, but isn't available
via this link. Please contact the BEC if you want to buy this text and we'll
give you the appropriate link.
|
EN version
|
FR version
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DE version
|
|
| Status |
Registered trilingual Belgian standard EN or FR or DE |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2010-04-01 |
| NBN Approval |
2010-07-30 |
| Belgian Official Journal |
2010-08-19 |
| Registration |
106954 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2010-04-01 |
| Date of availability (d.a.v.) |
2010-04-16 |
| Date of announcement (d.o.a.) |
2010-07-01 |
| Date of publication (d.o.p.) |
2011-01-01 |
| Date of withdrawal former edition (d.o.w.) |
2013-04-01 |
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