| Publication CODE |
Title |
| IEC 60249-3-1:1981 (1981-01) |
BASE MATERIALS FOR PRINTED CIRCUITS. PART 3: SPECIAL MATERIALS USED in CONNECTION WITH PRINTED CIRCUITS. SPECIFICATION NO. 1: PREPREG FOR USE AS BONDING SHEET MATERIAL in THE FABRICATION OF MULTILAYER PRINTED BOARDS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
20. |
Description
Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Withdrawn
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
1981-01-01 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
1981-01-01 |
| IEC last modification date |
2005-08-12 |
|
