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Publication details

Publication CODE Title
IEC 61190-1-2:2002 (2002-03) ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDER PASTES FOR HIGH-QUALITY INTERCONNECTIONS in ELECTRONICS ASSEMBLY
 
Price Excl. VAT Total number of pages, tables and drawings
122.00 € 35 P.
Description
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 61190-1-2:2007
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2002-03-22
ICS-Code (International Standards Classification) 35.040
NBN Status New
IEC publication date 2002-03-22
IEC last modification date 2007-04-26