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Publication details

Publication CODE Title
IEC 60749-30:2020 (2020-08) SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
 
Price Excl. VAT Total number of pages, tables and drawings
85.00 € 26.
Description
IEC 60749-30:2020 is available as IEC 60749-30:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3;
- expansion of 6.7 on solder reflow;
- inclusion of explanatory notes and clarifications.

Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2020-08-17
ICS-Code (International Standards Classification) 31.080.01
NBN Status New
IEC publication date 2020-08-17
IEC stability date 2025-12-31
IEC file modification date 2020-08-17
IEC last modification date 2020-08-17