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Publication details

Publication CODE Title
IEC 62418:2010 (2010-04) SEMICONDUCTOR DEVICES - METALLIZATION STRESS VOID TEST
 
Price Excl. VAT Total number of pages, tables and drawings
122.00 € 16 P.
Description
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2010-04-22
Registration 106123
ICS-Code (International Standards Classification) 31.080.01
NBN Status New
IEC publication date 2010-04-22
IEC stability date 2025-12-31
IEC last modification date 2018-11-22