Publication CODE |
Title |
NBN EN IEC 62148-21:2019 (2019-05) |
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 21: DESIGN GUIDE OF ELECTRICAL INTERFACE OF PIC PACKAGES USING SILICON FINE-PITCH BALL GRID ARRAY (S-FBGA) AND SILICON FINE-PITCH LAND GRID ARRAY (S-FLGA) |
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Price Excl. VAT |
Total number of pages, tables and drawings |
25.00 €
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4. |
Description
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
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Class |
C
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Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 62148-21:2019.
For the series NBN EN 50XXX, the standards are however complete.
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FR version
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EN version
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DE version
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Committee |
TC 86/SC 86C
FIBRE OPTIC SYSTEMS AND ACTIVE DEVICES
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Responsible |
Monsieur POLART Jules, Ingénieur
Chaussée de Brunehault, 380
7140
MORLANWELZ
Phone: 064 / 45 16 83
Fax: 064 / 45 16 83
E-mail: jules.polart@ceb-bec.be
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BEC Approval |
2019-04-15 |
NBN Approval |
2019-05-23 |
ICS-Code (International Standards Classification) |
33.180.20
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NBN Status |
New |
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Date of ratification (d.o.r.) |
2019-04-15 |
Date of availability (d.a.v.) |
2019-05-03 |
Date of announcement (d.o.a.) |
2019-07-15 |
Date of publication (d.o.p.) |
2020-01-15 |
Date of withdrawal former edition (d.o.w.) |
2022-04-15 |
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