| Publication CODE |
Title |
| IEC 60749-15:2003 (2003-02) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
21.00 €
|
11. |
Description
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2003-02-07 |
| ICS-Code (International Standards Classification) |
35.040
|
|
| IEC publication date |
2003-02-07 |
| IEC last modification date |
2010-10-28 |
|
