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Publication details

Publication CODE Title
IEC TR 61760-3-1:2022 (2022-06) SURFACE MOUNTING TECHNOLOGY - PART 3-1: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING ' GUIDELINES FOR THROUGH HOLE DIAMETER DESIGN WITH SOLDER PASTE SURFACE PRINTING METHOD
 
Price Excl. VAT Total number of pages, tables and drawings
201.00 € 26.
Description
IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2022-06-17
ICS-Code (International Standards Classification) 31.190
NBN Status New
IEC publication date 2022-06-17
IEC stability date 2027-12-31
IEC file modification date 2022-06-17
IEC last modification date 2022-06-17