Publication CODE |
Title |
IEC 62047-16:2015 (2015-03) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS |
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Price Excl. VAT |
Total number of pages, tables and drawings |
42.00 €
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21 P.. |
Description
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 ' to 10 ' in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
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Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
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Status |
IEC PUBLICATION |
Situation |
Currently active
|
|
Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
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Responsible |
Ir DELENS Marc
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BEC Approval |
2015-03-05 |
ICS-Code (International Standards Classification) |
31.080.99
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NBN Status |
New |
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IEC publication date |
2015-03-05 |
IEC stability date |
2022-12-31 |
IEC file modification date |
2015-03-04 |
IEC last modification date |
2018-11-12 |
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