| Publication CODE |
Title |
| IEC 61189-1:1997+AMD1:2001 CSV (2001-11) |
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
191.00 €
|
51. |
Description
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2001-11-22 |
| ICS-Code (International Standards Classification) |
31.180
|
|
| IEC publication date |
2001-11-22 |
| IEC stability date |
2023-12-31 |
| IEC last modification date |
2019-11-20 |
|
