Publication CODE |
Title |
NBN EN 61190-1-2:2014 (2014-05) |
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY
PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS in ELECTRONICS ASSEMBLY |
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Price Excl. VAT |
Total number of pages, tables and drawings |
25.00 €
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3 P. |
Description
Specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.
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Class |
C93
(TELECOMMUNICATIONS - ELECTRONIC PASSIVE ELECTRONIC COMPONENTS AND OPTICAL FIBRES (SEE ALSO C90))
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Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 61190-1-2:2014.
For the series NBN EN 50XXX, the standards are however complete.
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EN version
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FR version
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DE version
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Status |
Registered trilingual Belgian standard EN or FR or DE |
Situation |
Currently active
Replaces
NBN EN 61190-1-2:2007
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Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
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Responsible |
De heer VAN HECKE Luk
|
BEC Approval |
2014-03-26 |
NBN Approval |
2014-07-25 |
Belgian Official Journal |
2014-10-14 |
Registration |
147012 |
ICS-Code (International Standards Classification) |
31.190
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NBN Status |
New |
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Date of ratification (d.o.r.) |
2014-03-26 |
Date of availability (d.a.v.) |
2014-05-23 |
Date of announcement (d.o.a.) |
2014-06-26 |
Date of publication (d.o.p.) |
2014-12-26 |
Date of withdrawal former edition (d.o.w.) |
2017-03-26 |
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