| Publication CODE |
Title |
| IEC 61188-6-1:2021 (2021-02) |
CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES - DESIGN AND USE - PART 6-1: LAND PATTERN DESIGN - GENERIC REQUIREMENTS FOR LAND PATTERN ON CIRCUIT BOARDS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
249.00 €
|
63. |
Description
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2021-02-23 |
| ICS-Code (International Standards Classification) |
31.180
, 31.190
|
| NBN Status |
New |
|
| IEC publication date |
2021-02-23 |
| IEC stability date |
2026-12-31 |
| IEC file modification date |
2021-02-24 |
| IEC last modification date |
2021-02-24 |
|
