| Publication CODE |
Title |
| IEC TR 61760-3-1:2022 (2022-06) |
SURFACE MOUNTING TECHNOLOGY - PART 3-1: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING ' GUIDELINES FOR THROUGH HOLE DIAMETER DESIGN WITH SOLDER PASTE SURFACE PRINTING METHOD |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
201.00 €
|
26. |
Description
IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2022-06-17 |
| ICS-Code (International Standards Classification) |
31.190
|
| NBN Status |
New |
|
| IEC publication date |
2022-06-17 |
| IEC stability date |
2027-12-31 |
| IEC file modification date |
2022-06-17 |
| IEC last modification date |
2022-06-17 |
|
